EPO-TEK® 353NDT Heat Cure, Extended Working Life, 2-Part Epoxy, 2.5 Gram Packet (Ground Shipment Only)

EPO-TEK® 353NDT is a two-component, highly thixotropic epoxy adhesive designed for applications requiring precise placement, non-flowing performance, and excellent thermal stability. Its paste-like consistency minimizes migration after dispensing, making it ideal for fiber optic assemblies, semiconductor packaging, medical devices, and electronic component bonding.

Featuring an extended working life of approximately 3 hours, 353NDT provides ample processing time for complex assembly operations while delivering strong mechanical bonds and reliable performance under elevated temperatures. This medical-grade epoxy is widely used in optical and microelectronic manufacturing environments where accurate adhesive placement and high-temperature resistance are critical.

The convenient 2.5-gram packet contains pre-measured resin and hardener components for easy mixing and dispensing.

Please Note: Ground Shipment Only

Features & Benefits

• Highly thixotropic, non-sag, non-flowing formulation

• Extended 3-hour working life for assembly flexibility

• High-temperature resistance with Tg up to 90°C

• Strong adhesion with die shear strength ≥15 kg

• Suitable for precision fiber optic and optoelectronic assemblies

• Medical-grade epoxy formulation

• Ideal for semiconductor, hybrid, and microelectronics packaging

• Convenient 2.5 gram packet packaging

Typical Applications

• Fiber optic component assembly

• Opto-electronic packaging

• Endoscope manufacturing

• Semiconductor packaging

• Wafer-level packaging

• Underfill applications

• PCB-level assembly

• Hybrid microelectronics

• Circuit and electronic component bonding

Technical Specifications

Property	Value
Product Type	Two-Part Epoxy Adhesive
Color	Amber
Conductivity	Non-Conductive
Cure Type	Heat Cure
Number of Components	2
Pot Life	3 Hours
Viscosity	9,000 – 15,000 cPs @ 20 rpm
Thixotropic Index	3.8
Glass Transition Temperature (Tg)	90°C
Hardness	Shore D 80
Die Shear Strength	≥15 kg
Coefficient of Thermal Expansion (CTE)	43 × 10⁻⁶ in/in/°C (below Tg)
Thermal Conductivity	N/A
Refractive Index	N/A
Spectral Transmission	N/A

Recommended Cure Schedule

• 150°C for 1 minute

• 120°C for 5 minutes

• 100°C for 10 minutes

• 80°C for 30 minutes

Markets Served

• Electronics Assembly

• Optical Manufacturing

• Medical Devices

• Semiconductor Manufacturing

• Hybrid Microelectronics